Product Introduction:
G-668 Lead-free medium and low temperature solder paste series is made of special solder paste and spherical lead-free medium temperature tin bismuth silver or lead-free low temperature tin bismuth alloy powder with very low oxygen content. Excellent continuous printing image resolution; In addition, the solder paste contained in this product uses a highly reliable low-ionic halogen activator system, so that the residue after backwelding can be extremely reliable, even if it is not washed.

Usage characteristics:
1.) When continuous printing, its viscosity rarely changes over time, and very stable printing can be obtained.
2.) For 0.4-0.6mm and above spacing circuit, can complete exquisite printing.
3) Has excellent weldability, can show appropriate wettability in different parts.
4.) Can be applied to the general atmosphere or nitrogen welding furnace.
5.) Good weldability can also be obtained at extremely high peak temperatures.

A. Preheating zone: the heating rate is 1.0-3.0 ℃/ s, and the heating rate is too fast in the preheating zone, which is easy to make the fluidity and composition of the solder paste deteriorate, and it is easy to produce the phenomenon of exploding tin and tin beads
B. Constant temperature zone: temperature 130-160℃, time: 60-150 seconds is the most suitable. If the temperature is too low, it will return
After welding, the solder will not melt (recommended temperature rise rate < 2 ° C/s).
C. Back welding area: Peak temperature should be set at 210-230 ℃. The melting time is recommended to adjust the time above 220℃ to 30-90 seconds.
D. Cooling zone: Cooling rate < 4℃/ SEC >