Product Introduction:
This series of patch red adhesive is a single component high temperature fast curing epoxy adhesive, used for SMD components on printed circuit board bonding, has excellent thixotropy, suitable for high-speed SMT patch machine dispensing and steel screen printing, high bonding strength after curing.

Product features:
1, allow low temperature hardening;
2, despite ultra-high-speed coating, a small amount of coating can still maintain a stable shape without drawing and collapsing;
3, for a variety of surface sticking parts, can obtain stable subsequent strength;
4, good storage stability;
5, with high heat resistance and excellent electrical characteristics;
6, can be used for screen printing and dispensing.

Scope of application:
The surface-mount element is bonded to the printed circuit board before wave soldering, which is suitable for scraping and dispensing of hole plate printing.

Curing conditions:
1, it is recommended that the curing condition is more than 120 seconds after the PCB surface temperature reaches 150℃, or more than 150 seconds after reaching 120℃.
2, the higher the curing temperature, and the longer the curing time, the higher bonding strength can be obtained, according to the PCB board mounted component material, the size is different and the actual temperature of the additional agent will be different, so please find the most suitable curing conditions according to the actual production situation.